Magnetic particle based biosensor

ABSTRACT

A biosensor system and method of its use for detecting particles on the surface of an integrated circuit is disclosed. The system can include a light source and a plurality of optical sensors formed on an integrated circuit. The particles can be positioned the surface of the integrated circuit whereby the particles can cast a shadow or shadows that reduces the amount of light transmitted from the light source to the optical sensors. The surface of the integrated circuit can include one or more optical sensing areas whereby the presence of one or more particles may significantly or measurably reduce the amount of light incident on one or more optical sensor.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/392,895, filed 28 Dec. 2016, which is a continuation of U.S. patentapplication Ser. No. B13/858,794 (now U.S. Pat. No. 9,568,415), filed 8Apr. 2013, which is a continuation of PCT Application No. US2011/055467,filed 7 Oct. 2011, which claims priority to U.S. Provisional ApplicationNos. 61/390,809, filed 7 Oct. 2010, and 61/415,183, filed 18 Nov. 2010,all of which are incorporated by reference herein in their entireties.

NOTICE OF MATERIAL SUBJECT TO COPYRIGHT PROTECTION

A portion of the material in this patent document is subject tocopyright protection under the copyright laws of the United States andof other countries. The owner of the copyright rights has no objectionto the facsimile reproduction by anyone of the patent document or thepatent disclosure, as it appears in the United States Patent andTrademark Office publicly available file or records, but otherwisereserves all copyright rights whatsoever. The copyright owner does nothereby waive any of its rights to have this patent document maintainedin secrecy, including without limitation its rights pursuant to 37C.F.R. § 1.14.

SUMMARY OF THE INVENTION

Systems, devices and methods for detecting and manipulating magneticparticles are disclosed. Various aspects of the variations describedherein may be applied to any of the particular applications set forthbelow or for any other types of sensors. The variations disclosed may beapplied as a standalone system or method, or as part of integrateddetection or biosensor systems. Different aspects of the variationsdisclosed can be used individually, collectively, or in combination witheach other.

A biosensor configured to detect magnetic particles is disclosed. Thesystem can have a light source and an integrated circuit containingoptical sensors. Particles on the surface of the integrated circuit cancast a shadow that can change the amount of light from the light sourcethat is received by the optical sensors. In this way the particlesgenerate a contrast ratio, defined as the ratio of light detected by anoptical sensor with no particle positioned over said optical sensordivided by the light detected by the optical sensor with a particlepositioned over said optical sensor. The optical sensors can detect themagnetic particles by measuring the amount of incident light on anoptical sensing area. The optical sensing area may be described as thearea on the surface of the integrated circuit containing one or moreoptical sensors capable of detecting particles. One or more distinctoptical sensing areas can be on the surface of the integrated circuit.

The system, for example in a biosensing format, can detect magneticparticles 81 that can bind strongly and/or specifically to the surfaceof the integrated circuit as a result of one or more chemical reactionsinvolving one or more target species in an aqueous sample.

The magnetic particles can react with one or more target species inaqueous sample. The magnetic particles can be attracted to the opticalsensing area on the biologically coated surface of the integratedcircuit by magnetic concentration forces that can be generated bycurrent passing through concentration conductors embedded in theintegrated circuit. The magnetic particles that react with the targetspecies can bind specifically to the surface of the integrated circuitexposed to the aqueous sample. The magnetic particles that do not reactwith the target species can bind non-specifically to the surface of theintegrated circuit and can be removed from the optical sensing area.

One or more magnetic separation field generators embedded in theintegrated circuit can produce magnetic separation forces. The magneticseparation forces can remove the non-specifically bound magneticparticles from the optical sensing area, for example such that only thespecifically bound magnetic particles remain.

The magnetic particles remaining in the optical sensing area can cast ashadow and reduce the amount light transmitted from the light source tothe optical sensors. The optical sensors can detect the presence of themagnetic particles by measuring the amount of incident light.

The optical sensors can be similar in size to the magnetic particle suchthat each sensor can only detect the presence of one particle.

The optical sensors can be individually addressable and their electricalsignals can be amplified, digitized, stored and processed by circuitryinternal or external to the integrated circuit.

The details of these and other variations are set forth in theaccompanying drawings and the description below.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional side view of a variation of the system 10that includes a sample preparation and delivery module (SPDM) 8, a lightsource 2, an integrated circuit 12 (IC), a printed circuit board (PCB)9, a display 1, and a casing 11.

FIG. 2 is a cross sectional side view of a variation of the system 10 asthe aqueous sample 5 is filtered and wicked via capillary action througha delivery capillary 14 onto a surface 7 of the integrated circuit 12.

FIG. 3 is a cross sectional side view of a variation of the system 10showing the aqueous sample 5 in the process of wicking up asedimentation capillary 13 due to capillary action. Once the aqueoussample 5 reaches the top of the sedimentation capillary 13, the aqueoussample 5 can re-hydrate a reagent sphere 3, releasing the particles 4 tosediment onto the surface 7 of the IC 12.

FIG. 4 is a cross sectional side view showing a light source 2positioned on the PCB 9 and a reflector 20 placed on the ceiling of thecasing 11 above the IC 12 that may reflect the light originating fromthe light source 2 onto the surface 7 of the IC 12.

FIGS. 5A and 5B are cross sectional side and top views, respectively, ofa variation of the IC 12 with two optical sensors 40 and two particleson its surface 7 casting shadows. Particle 32 can be detected by theoptical sensor 30, while optical sensor 31 cannot detect any particles.

FIG. 6 is a cross sectional side view of trenches etched into the IC.

FIG. 7A and 7B are top and cross sectional side views, respectively, ofa variation of the IC 12 containing a magnetic separation fieldgenerator implemented with separation conductors.

FIG. 7C is a cross-sectional view that presents the scenario from FIG.7A and 7B after non-specifically bound magnetic particle 63 is attractedto a separation conductor 60.

FIG. 8A and 8B are top and cross sectional side views, respectively, ofa variation of the IC 12 that can have optical sensors 40 in aseparation area 70.

FIG. 9A and 9B are top and cross sectional side views, respectively, ofa variation of the IC 12 that can have a separation conductor 60 and aconcentration conductor 80.

FIG. 10A and 10B are top and cross sectional side views, respectively,of a variation of the IC 12 that can have a separation conductor 60 andtwo concentration conductors.

FIG. 11A and 11B are top and cross sectional side views, respectively,of a variation of the IC 12 with light shield layers 101.

FIG. 12 is a top view of a variation of the IC 12 with a surface 7 thathas been coated with multiple reagents and controls.

FIGS. 13A and 13B show a top and cross sectional side view,respectively, of a variation of the IC 12 adapted to generate multipleforces, F1 and F2, on magnetic particle 124 and magnetic particle 125,respectively.

FIGS. 14A and 14B show a top and cross sectional side view,respectively, a scenario presented in FIGS. 13A and 13B where the firstforce F1 can be strong enough to displace magnetic particle 124 fromatop the first magnetic particle sensor 122, while the second force F2can be weak enough to leave the second magnetic particle 125 immobilizedatop the second magnetic particles 8lsensor 121.

FIG. 15 is a cross sectional side view of a variation of the system 10with dried reagent 150 throughout the delivery capillary 14 and thesedimentation capillary 13 that can promote wicking of the aqueoussample 5.

FIGS. 16A and 16B are cross sectional side views of a variation of theinlet to the delivery capillary 14.

FIG. 17 is a cross sectional side view of a variation of the inlet ofthe delivery capillary 14 with wicking capillaries 160.

FIG. 18 is a cross sectional side view of a variation of the inlet ofthe delivery capillary 14 with dried reagents and wicking capillaries160.

FIG. 19 is a cross sectional side view of a variation of the inlet ofthe delivery capillary 14 with a porous material 180.

FIG. 20 is a cross sectional side view of a variation of the system 10including a reagent sphere 3 placed into a tapered section at the top ofthe sedimentation capillary 193.

FIG. 21 is a variation of a method performed by the system 10.

DETAILED DESCRIPTION

Biosensors that use non-magnetic or magnetic particle labeling toperform assays are disclosed. A label particle serves as an aid indetecting the presence of specific binding between a receptor and thetarget analyte which may consist of immunological bonds, nucleic acidbonds, covalent bonds, ionic bonds, hydrogen bonds, and other bindingphenomena capable of being differentiated from non-specific binding).

Particles may be any spherical or arbitrarily shaped localized objects,from several nanometers to tens of microns in diameter, that modulateincoming light (e.g., reflect the light, refract the light, block thelight, increase the intensity of the light, change the wavelength orspectral composition of the light). Magnetic particles also displaydiamagnetic, ferromagnetic, ferrimagnetic, paramagnetic,superparamagnetic, or antiferromagnetic behavior. Magnetic particles mayinclude individual nanometer-sized particles of magnetic material (oftenreferred to as magnetic nanoparticles or magnetizable nanoparticles) orlarger aggregates of such magnetic nanoparticles to form an essentiallyspherical bead (often referred to as magnetic beads, magnetizablebeads). Magnetic particles may be covered with or encapsulated by anon-magnetic material, such as a polymer, ceramic, or any othernon-magnetic material, that may be coated with biological or chemicalmolecules to react specifically to a target analyte. A non-magneticmaterial refers to any material that displays no magnetic properties ordisplays magnetic properties that are much smaller in magnitude (e.g.,less than 1%) than the magnetic material in magnetic particles. Magneticparticles may be from several nanometers to tens of microns in diameter.

FIG. 1 shows a system 10 that includes a sample preparation and deliverymodule (SPDM) 8, a light source 2, an integrated circuit (IC) 12, aprinted circuit board (PCB) 9, a display 1, and a casing 11. The system10 may be configured to perform a biological and/or chemical assay on anaqueous sample 5 by introducing, detecting, and/or quantifying particles4 binding on the surface 7 of the IC 12. An assay may be any procedureused to detect the presence of a target analyte or to quantify theconcentration or amount of the target analyte in the aqueous sample 5.Target analytes may be enzymes, proteins, small molecules, nucleicacids, and other biological, chemical, and inorganic species, orcombinations thereof. The aqueous sample 5 may be whole blood, plasma,serum, diluted blood derivatives, sputum, pulmonary lavage, fecalsamples, oral samples, nasal samples, lachrymal fluid, other bodilyfluids, laboratory samples, environmental samples, any other fluidspotentially containing one or more target analytes, or combinationsthereof. The systems and methods of their use as described herein can beapplied to known target analyte detection schemes such as thosedescribed in PCT Publication No. WO 2009/091926, filed 15 Jan. 2009(titled: INTEGRATED MAGNETIC 12FIELD GENERATION AND DETECTION PLATFORM)which is incorporated by reference herein in its entirety. Any one ofthe components described above may be omitted, replaced, or modified.

Further, FIG.1 shows a filter 6 that can be placed at the top of theSPDM 8. The filter 6 may be any type of filter (e.g., membrane filter,microfilter, syringe filter) capable of blocking or trapping particulatematter (e.g., red blood cells, white blood cells, other cells and micronto millimeter size particulates) and thus removing the particulatematter from the aqueous sample 5. The filter 6 may also be adapted toremove certain biological or chemical molecules from the aqueous sample5 (e,g., a chemical coating on the filter 6 may remove molecules thatcompete with the target analyte or interfere, in any way, with theassay). Further, the filter 6 may include chemicals, molecules, andother dissolvable matter than may aid the assay protocol. For example,the filter 6 may contain anticoagulation factors that prevent bloodsamples from coagulating. Further still, the filter 6 may be coated inhydrophilic material to aid in aqueous sample 5 absorption.

Further, FIG. 1 shows a delivery capillary 14 and a sedimentationcapillary 13. The delivery capillary 14 can connect the membrane filter6 to the sedimentation capillary 13 and thus allow the aqueous sample 5to flow from the filter 6 to the sedimentation capillary 13. In onevariation of the system 10, the filter 6 may be placed inside thedelivery capillary 14. The sedimentation capillary 13 may be placed overthe IC 12 and in contact with reagents containing particles 4. Thereagents may be configured in a sphere (i.e., a reagent sphere 3) or anyother shape. The reagent sphere 3 may rest on top of the sedimentationcapillary 13 and may preferably be dry or lyophilized. The IC 12 may bemounted by any known method (e.g., wire-bonding, flip-chip assembly,conductive epoxy, and combination thereof) to a PCB 9. The system 10 canbe encapsulated by a casing 11 with an opening for a digital display 1.

The SPDM 8 can be configured to accept an aqueous sample 5 from a samplesource (e.g., a finger stick, a pipette, a syringe, or combinationsthereof), filter the aqueous sample 5 using the filter 6, deliver theaqueous sample 5 to the surface 7 of the IC 12 and to the reagent sphere3, re-hydrate dried particles 4 within the SPDM 8, mix and incubate theparticles 4 with the aqueous sample 5 and subsequently introduce theparticles 4 onto the surface 7 of the IC. The systems and methods of usedescribed herein can be applied to known SPDM's such as those describedin PCT Application No. WO 2011/059512, filed 16 Nov. 2010 (titled:FILTRATION DEVICE FOR ASSAYS), which is incorporated by reference hereinin its entirety. Other variations, components, and functions of the SPDM8 are further described below.

FIG. 2 shows the aqueous sample 5 being wicked into the filter 6 whereparticulate matter such as whole blood cells can be blocked. The aqueoussample 5 can then be wicked from the back of the filter 6 into thedelivery capillary 14 and delivered onto the surface 7 of the integratedcircuit 12, as shown by an arrow. The flow in the delivery capillary 14can be maintained by capillary action. In cases where the system 10 isplaced vertically and the delivery capillary 14 is below the filter 6,gravity can also assist the flow of the aqueous sample 5. Pressure fromvacuum or pumping can also be used to facilitate the flow of the aqueoussample 5 through the delivery capillary 14. As discussed above, thefilter 6 may be a membrane filter and may have a surface area between0.1 mm² and 100 cm² and a thickness between 10 μm and 2 mm. The membranefilter can be composed of polyvinylpyrrolidone/polyethersulfone(PVP/PES). The membrane filter can have a porosity gradient toeffectively trap cells in whole blood while allowing blood plasma andthe analytes therein to pass through the membrane. A preferable filteris a 0.26 mm thick PVP/PES filter with a 35 μm pore size on the top anda 2.5 μm pore size on the bottom. The membrane filter can be oriented ina horizontal plane. The membrane filter can be oriented in a planeparallel to the surface 7 of the IC 12. The delivery capillary 14 can bebetween 0.5 mm and 10 cm in length and 10 μm and 5 mm wide. A preferabledelivery capillary 14 is 5 mm long and 0.25 mm wide.

FIG. 3 shows the aqueous sample 5 in the process of wicking up thesedimentation capillary 13 due to capillary forces. Gravity can alsoassist the flow of the aqueous sample 5up the sedimentation capillary 13if the sedimentation capillary 13 is placed below the bottom of thefilter 6. Pressure from vacuum or pumping can also be used to facilitatethe flow. Once the aqueous sample 5 reaches the top of the sedimentationcapillary 13, the aqueous sample 5 can rehydrate the dry reagent sphere3 placed at the top of the sedimentation capillary 13. The particles 4can be released and sediment through the aqueous sample 5 to the surface7 of the integrated circuit 12, as shown by arrows. As the particles 4sediment, the particles 4 can react with the target analytes in theaqueous sample 5 and bind specifically to the surface 7 of the IC 12. Ifthe particles 4 do not react with any of the target analytes in thesample, the particles 4 may bind non-specifically to the surface 7 ofthe IC 12. The sedimentation capillary 13 can be between 0.5 mm and 10cm in length and 10 μm and 5 mm wide. A preferable delivery capillary 14is 3mm long and lmm wide. The dry reagent sphere 3 can be manufacturedby lyophilization and placed on the top of the sedimentation capillary13 using an automated pick and place tool.

The surface 7 of the IC 12can be illuminated by a light source 2. Thelight source 2 can generate and/or direct light to illuminate thesurface 7 of the IC 12. The light source 2 may be or include aluminescent light source such as a LED, incandescent light source suchas a light bulb, any other source of light internal or external to thesystem 10, or combinations thereof. The light source 2 may be anyexternal light source (e.g., the sun, an external lamp, ambient light ina room, and any other external light source that may be used instead ofor in combination with an internal light source to illuminate thesurface 7 of the IC). The light source 2 may be positioned anywhere inthe system 10 or external light may be inputted anywhere into the system10 and an optical module (not shown) may direct the light onto thesurface 7 of the IC 12. The light source 2 may be integrated on the IC12 itself. For example, a direct semiconductor may be used to fabricatethe IC 12 or a portion of a direct semiconductor may be added to the IC12(e.g., via wafer bonding, molecular beam epitaxy, and other suitablefabrication processes). The light source 2 may be configured to producea light intensity anywhere from 1 mW/m² to 10 kW/m².

A shadow may refer to any type of light modulation caused by a particle4 in the direction of propagation of light that increases or decreasesintensity, changes the spectral composition, blocks, changes thepolarization, or otherwise modifies the properties of said light. One ormore light sources can be situated or positioned directly above theintegrated circuit 12 such that particles 4 situated above the surface 7of the IC 12 cast a shadow that is projected downward onto the surface 7of the IC. The shadow then may be detected by one or more opticalsensors 40 situated below the surface 7 of the IC 12. However, the lightsource(s) may be positioned and directed at any angle relative to thesurface 7 of the integrated circuit 12 such that the light shines onleast a portion of IC 12 surface 7.

In a variation of the system 10, multiple sources of light mayilluminate the surface 7 of the IC 12 indirectly and/or at obliqueangles. Multiple ICs can be illuminated by one source of light. Theshadows or otherwise the modulated light due to the particles 4 can beprojected at oblique angles (i.e., not straight downward).

The optical module 21 may include one or more reflectors 20, one or morelenses, one or more optical fibers, one or more light pipes, and anyother component or combination of components capable of directing light.For example, as shown in FIG. 4, the light source 2 may be positioned onor integrated into the PCB 9 and a reflector 20 placed on the ceiling ofthe casing 11 above the IC 12 may reflect the light originating from thelight source 2 onto the surface 7 of the IC 12. The light source 2 maybe modulated (i.e., turned on and turned off repeatedly) at a certainfrequency, at multiple frequencies, following a certain predetermined orrandom sequence in time, or combinations thereof. For example, the lightsource 2 may be turned on for a predetermined amount of time prior tointroducing the particles 4 in order to calibrate the optical sensors 40on the IC 12 (e.g., by measuring the sensitivity, sensitivitydistribution, saturation level, and other relevant parameters of theoptical sensors 40 and underlying electronic circuits) and to calibratethe light source 2 (e.g., measure and adjust the light intensity, lightuniformity, and other relevant parameters of the light source 2).Subsequently, the light source 2 may be turned on for a predeterminedamount of time to allow for a shadow or any other form of lightmodulation to be created by the particles 4 and detected by the opticalsensors 40.

The IC 12 can be a substrate that can incorporate one or more opticalsensors 40 and associated electronic circuits. At least a portion of thesurface 7 of the IC 12 is coated with receptors and the IC 12 isconfigured to accept particles 4 that may bind specifically (i.e., viathe receptors) or non-specifically to the surface 7 of the IC 12,depending on the concentration of the target analyte. The IC 12 may beused to remove any non-specifically binding particles and quantify thenumber or concentration of remaining specifically bound particles. Thenumber of specifically bound particles may be proportional to theconcentration of the target analyte in the sample. Generally speaking,specifically bound particles are particles that are bound to a surface 7via at least one specific bond (i.e., antibody-antigen bonds). Generallyspeaking, non-specifically bound particles are particles that are boundto the surface 7 with weaker bonds (e.g., Van Der Walls). Specificallybound particles refer to particles that are bound with one or morespecific biochemical bonds such as one or more immunological bonds andother bonds discussed above and are not removed from the surface 7 byseparation forces. Non-specifically bound particles may be particlesthat are removed from the optical sensing area 41 by separation forces.Non-specifically bound particles may still contain one or more specificbonds but generally contain less specific bonds than specifically boundmagnetic particles. For example, for large particles (e.g., thosegreater than 100 nanometers in diameter), multiple specific bonds may berequired for the particles to remain stationary in the presence ofseparation forces (i.e., to be considered specifically-bound). Forexample, particles with 10 or more immunological bonds may be neverremoved with separation forces and thus are always consideredspecifically bound, particles with fewer than one immunological bond maybe always removed with separation forces and thus are considerednon-specifically bound, whereas particles in between may be eitherspecifically-bound or non-specifically bound. The optical sensors 40 onthe IC 12 are configured to detect the shadow cast by the particles, asdescribed above.

Particles may serve as light concentrators through internal or externalreflections. For example, the amount of light incident on opticalsensors 40 may be increased by over 1% and optical sensors 40 on the ICcan be configured to detect this light intensity increase. The particlesmay modulate the light (e.g., filter the frequency spectrum of thelight, fluoresce with another frequency of light, change the color ofthe light). Likewise, the optical sensors 40 may be configured to detectany of these color changes, for example by using bayer color filterarrays placed over the optical sensors 40 or by using different opticalsensor 40 types such as N-well diodes, N+ diodes, poly gate diodes, andP+ diodes, which are sensitive to different optical frequencies. Theelectronic circuits may be any combination of metal connections,resistors, capacitors, inductors, transistors, diodes, amplifiers,digitizers, digital logic, and other integrated electronic circuits usedto obtain, forward, process, and output a signal from the opticalsensors 40. The circuitry may be used to individually address any of theoptical sensors 40 in an array, either serially or in parallel. The ICmay be fabricated in any commercial process (e.g., CMOS, CCD, BJT) ormay be made in a custom fabrication process. Other variations,components, and functions of the IC 12 are further described below.

The PCB 9 can be any substrate that stores the IC 12 and connects the IC12 to any other components. The PCB 9 can contain one or more batteries,one or more control modules, one or more voltage regulators, one or moresensors, one or more actuators, one or more displays, and combinationsthereof. As discussed above, the PCB 9 may also include the light source2 that can provide light into the IC 12 via an optical module 21. ThePCB 9 may be placed on the bottom of the housing or in any otherposition in the housing and may contain connectors and daughter-boardsor any other extensions that may contain any of the components describedabove or described below in any position and orientation inside oroutside the housing containing the SPDM 8. The PCB 9 components internalto the system 10 and the circuitry and sensors of the IC 12 may becontrolled by a control module integrated on the IC 12 (e.g., a controlmodule core, a discrete control module mounted on the PCB 9, a centralprocessing unit (CPU), a digital signal processing (DSP) unit, afield-programmable gate array (FPGA), or any other control module orcombination of control modules). The terms control module and controlmodule may be used interchangeably in this specification and may belocated on the PCB 9, in the IC, or in any other part of the system 10.The control module may store assay calibration parameters. Assaycalibration parameters may include a standard curve that relates thenumber or concentration of particles 4 detected to the concentrationand/or amount of the target analyte in the aqueous sample 5. Assaycalibration parameters may also include an assay time which may includeany time intervals between different steps in an assay (e.g., time fromaqueous sample 5 detection to optical sensor array readout, readoutduration, magnetic separation force duration, and any other timeinterval). Assay calibration parameters may also include magneticseparation force and magnetic concentration force strength, duration,frequency, pattern. Assay calibration parameters may include any otherparameters that may affect assay results. The assay calibrationparameters are adjusted in response to measurements made by any sensorsand components of the system 10.

The system 10 can contain one or more inertial sensors. The inertialsensors may include accelerometers, gyroscopes, tilt sensors, and anyother sensors capable of detecting and quantifying position, velocity,acceleration, orientation, and combinations thereof. The inertialsensors are configured to sense the physical parameters discussed aboveand output them to the control module. The control module may beconfigured to read the output from the inertial sensors and determine ifany of the physical parameters are unusual and/or out of the acceptablerange. For example, the inertial sensors may send an output to thecontrol module indicating that the orientation of the system 10 isincorrect (e.g., the IC 12 is upside down while the assay is beingperformed) or the acceleration of the system 10 is too high (e.g., auser is shaking or swinging the system 10 while the assay is beingperformed). As a result, the control module may send a signal to theuser via 102 the display 1 that an incorrect action took place and thatthe results of the assay are invalid. Alternatively, the control modulemay attempt to compensate for any effects resulting from incorrectorientation and/or applied acceleration. The control module can modifyand/or selects the assay calibration parameters based on the measuredvalues of relevant physical parameters. The control module can performmore detailed compensation on the sensor level, for example, by applyingdifferent weights to signals from different optical sensors 40positioned in different locations on the IC, or completely ignoring thereading from certain optical sensors 40 altogether. The control modulemay also modify the assay time based on the reading obtained from theinertial sensors (e.g., the optical detection may be turned onsooner/later, allowing particles 4 less/more time to incubate with thetarget analyte, respectively). The inertial sensors may be mounted inany component of the system 10 (e.g., mounted as a chip on the PCB 9,integrated into the IC, mounted on any wall of the casing 11, orcombinations thereof).

The PCB 9 and/or the IC 12 may contain a read-only memory module (ROM),a random access memory module (e.g., SRAM, DRAM), or other modulecapable of storing data (PROM, EPROM, EEPROM, Flash, and any otherstorage medium). The data module may be part of the control module andmay be used to store calibration data from the various sensors,actuators, and modules in the system 10 that is derived just prior,during, or after performing an assay. The data module may storecalibration data generated during the design process or after the IC 12is manufactured and/or the system 10 is assembled. For example, thecalibration data may compensate for variations in manufacturing (e.g.,ILD thickness, optical sensor 40 sensitivity, and other parameters thatmay vary during manufacturing). In another example, the calibration datamay compensate for variations in surface coating (e.g., surfacechemistry, receptor density, receptor type, and other parameters thatcan vary during surface 7 coating). The calibration data can includeassay calibration parameters that are derived from one or more chips ina particular batch (e.g., from the same wafer, same surface coatingbatch, same assembly batch).

The system 10 can include one or more temperature sensors. Thetemperature sensors may include a thermistor, a semiconductor sensor, athermocouple, or combinations thereof, and may be configured to measurethe temperature of the surroundings (e.g., the air temperature outsidethe system 10, the temperature of the SPDM 8, and/or the temperature inthe vicinity of the IC 12) or the temperature of the aqueous sample 5directly (e.g., the SPDM 8 may be configured to place the temperaturesensor in contact with the aqueous sample 5, or the sensor may belocated at or near the surface 7 of the IC 12). An assay may havedifferent assay calibration parameters (e.g., different standard curve,different suitable assay time) at each temperature level and as theassay kinetics may be sped up or slowed down depending on thetemperature level. Accordingly, the temperature reading may be sent tothe control module and may be used to adjust the assay calibrationparameters to compensate for the changes in temperature. Aside frombeing integrated or attached to the PCB 9, the temperature sensor may bemounted in any other component of the system 10 (e.g., integrated intothe IC 12, mounted on any wall of the casing 11, or combinationsthereof). The IC 12 may contain one or more heating elements (e.g.,resistors, coils, wires) that can be used to keep the temperature of thesurface 7 of the IC 12, the aqueous sample 5, and/or the entire system10 at a nearly constant, predetermined value. The information from thetemperature sensors can be read and the control module can enable theheating elements in order to keep the temperature constant in the rangeof 20° C.-40° C.

The system 10 can include one or more moisture sensors. The moisturesensor(s) may be placed in contact with the aqueous sample 5 and may beused to detect the presence of the aqueous sample 5 (e.g., usingelectrodes to detect a change in resistance or a change in capacitancebetween the electrodes as a result of the presence of the aqueous sample5). The moisture sensor(s) may send a signal to the control module,either continuously or upon detection of the aqueous sample 5,indicating the moisture level reading, and the control module may enableother components of the system 10 upon receiving a signal indicating thepresence of the aqueous sample 5. Aside from being integrated orattached to the PCB 9, the moisture sensor may be mounted in any othercomponent of the system 10 (e.g., integrated into the IC 12, mounted onany wall of the casing 11, or combinations thereof).

The PCB 9 can include one or more viscosity sensors. A viscosity sensorcan be placed in contact with the aqueous sample 5. The viscosity ofblood plasma can vary. Higher fluid viscosities may lead to longer assaykinetics and longer particle sedimentation times. Accordingly, theviscosity sensor(s) may send a measurement of the viscosity to thecontrol module which in turn may modify the assay time other assaycalibration parameters. Aside from being integrated or attached to thePCB 9, the viscosity sensor(s) may be mounted in any other component ofthe system 10 (e.g., integrated into the IC 12, mounted on any wall ofthe casing 11, or combinations thereof). By including temperature,viscosity, orientation, acceleration, and any other environmentalfactors into account when performing an assay, the results of the assaymay be adjusted appropriately, via the assay calibration parameters, toeffectively cancel out these environmental effects, leading to increasedrobustness, accuracy, and consistency of results in diverse environmentsand settings. The moisture sensors placed at different points along thepath of the aqueous sample 5 can be used to measure the viscosity of thefluid. Alternatively or in combination, the optical sensors 40 can beused to measure the time from the reagent sphere 3 re-hydrating to thetime the particles 4 sediment onto the surface 7 of the IC 12. This timecan also be used to determine the viscosity and incubation timeinformation.

The system 10 can include a vibrator module. The vibrator module mayinclude an electric motor with an unbalanced mass or any other moduleand method for generating vibrations. The vibrator module may be turnedon during the sample delivery steps (i.e., between the time when theaqueous sample 5 is introduced and the time the particles 4 finishsedimenting on the surface 7 of the IC 12) in order to agitate theaqueous sample 5 and/or the particles 4 and allow the particles 4 tomore quickly disperse in the aqueous sample 5 and speed up assaykinetics. The vibrator module may be enabled upon detection of theaqueous sample 5 when the aqueous sample 5 comes in contact with theSPDM 8 and/or the IC. The amplitude, frequency, and/or pattern of thevibrations can be controlled by the control module and adjusted based onvarious parameters obtained from the environmental sensors discussedabove and based on any assay calibration parameters. For example,vibration amplitude may be increased if the temperature is low and/orthe viscosity of the aqueous sample 5 is high in order to speed up assaykinetics.

The PCB 9 can contain one or more external electromagnets or permanentmagnets generating fields from 0.1 μT to 1 T at excitation frequenciesfrom DC to 100 MHz. Magnets can have an appreciable effect on theparticles 4 if the particles 4 are magnetic particles 81. A permanentmagnet may be placed below the IC 12 or in close proximity to the IC 12in order to pull magnetic particles 8 lmore quickly towards the surface7 of the IC 12 (i.e., increase the sedimentation velocity of themagnetic particles 81 to as high as 10 mm per second). The permanentmagnet may be replaced with an electromagnet (e.g., Helmholtz coil,current line, or combinations thereof) mounted onto the PCB 9 and belowthe IC 12 to selectively generate magnetic fields and magnetic forces. Asecond electromagnet may be placed above the IC 12, near the ceiling ofthe casing 11, in order to pull the magnetic particles 81 up from thesensor surface 7. This could be used to increase the incubation time toover 10 minutes or to perform magnetic separation steps. One or moreelectromagnets may be placed on the sides of the PCB 9 around the samplechamber or extend into the system 10 and around the sample chamber inorder to generate lateral forces on the magnetic particles 81. Any ofthe electromagnets placed above, below, or to the sides of the samplechamber may be used to agitate the magnetic particles 81(e.g., move themside to side, make them vibrate, make them change orientation) in orderto create convective forces in the aqueous sample 5 and/or to morequickly sediment the magnetic particles 81 to the IC 12 surface 7.Electromagnets configured to generate lateral forces may be used tocompensate any tilt in the system 10 (e.g., if the system 10 is tiltedto the left, an electromagnet on the right side may turn on to ensuremagnetic particles 81 sediment evenly and do not aggregate on the leftside of the IC). The permanent magnets or electromagnets may be mountedin any other component of the system 10 (e.g., integrated into the IC,mounted on any wall of the casing 11, or combinations thereof).

The display 1 can be any display known in the prior art (e.g., LCDdisplay, LED display, OLED display and any other type of display) thatmay show the results of an assay (e.g., concentration of the targetanalyte, amount of the target analyte, and any other relevant results).The display 1 may show status indicators (e.g., ready, busy, testing,done) and may show visual instructions to the user on how to use thesystem 10 to perform a measurement. A speaker may also be integratedinto the system 10 to deliver audio instructions.

The casing 11 can be an external shell that houses all the othercomponents of the system 10. The casing 11 may be made in any standardor custom manufacturing process (e.g., injection molding) and may bemade from any standard material (e.g., plastic).

FIGS. 5A and 5B shows a cross section view and top view, respectively,of the light source 2 and the IC 12. The IC 12 can include one or moreoptical sensors 40 configured in an array. Each optical sensor 40 may beintegrated into the IC 12 and implemented in any technology (e.g.,junction photodiodes, avalanche photodiodes, PIN photodiodes, activepixel sensors, charge-coupled devices, light-sensitive resistors, orother solid-state optical sensors 40). Each optical sensor 40 may beindividually addressable and may output electrical signals that may beamplified, digitized, stored and processed by circuitry on the IC 12and/or the PCB 9. Each optical sensor 40 may be configured to detect ashadow 34 cast by a particle 4 as a result of the particle blocking thelight rays from the light source 2. For example, optical sensor 30detects particle 32 because particle 32 casts a shadow 34 over thesensor 30, decreasing the light intensity incident on optical sensor 30from the light source 2. Consequently, as a result of particle 32blocking a portion of the light from the light source 2, optical sensor30 generates a signal that is different from a baseline signal withoutparticle 32, thus indicating the presence of particle 32 over thesensor. On the other hand, optical sensor 31 does not detect a particleas no light is blocked from the light source 2. Other types of lightmodulation may be employed to detect particles 4. For example, theparticles 4 can be made to modify the spectral composition (e.g. color)of the light, and the optical sensors 40 may be configured to detectsuch modification, thus detecting the presence of beads near the sensor.The optical sensing area 41 corresponds to the area on the surface 7 ofthe integrated circuit 12 where optical sensors 40 can detect thepresence of particles 4. The optical sensing area 41 may be a column ofoptical sensors 40 and several columns of optical sensors 40 may beplaced adjacent to each other to create a large array of optical sensors40. The column of optical sensors 40 can include separation andconcentration conductors. The columns of optical sensors 40 can beplaced at a distance from each other to leave space in between thecolumn to separate the non-specifically bound magnetic particles.

Depending on the size of an optical sensor 40 and the particles 4 used,each optical sensor 40 can detect one or more particles 4 or severaloptical sensors 40 can detect the same single particle 4. In general,the optical sensors 40 can be square and range from 0.1 μm to 200 μm ona side. A preferable side length for an optical sensor 40 designed fordetecting micron-sized particles may range between 0.5 μm and 10 μm.Additionally, the optical sensors 40 can be any shape such astriangular, circular, rectangular, or any other polygon or combinationthereof. An optical sensor 40 significantly larger than a particle 4 maygenerate a signal proportional to the number and/or density of particlesresiding over its surface. Conversely, optical sensors 40 smaller thanone particle 4 may generate signals indicating the portion and/ororientation of a particle 4 residing over the surface 7 containing theseoptical sensors 40. Optical sensors 40 may be made small enough andpacked densely enough to guarantee that no matter where a particle 4lands in the optical sensing area 41, that particle is always detectedby at least one optical sensor. For example, a 2-dimensional array of 4μm×4 μm square optical sensors 40 with a pitch between their centers of4.5 μm may detect all 4.5 μm particles 4 that land in the opticalsensing area 41. Individual detection of particles 4 may enabledetection contrast ratios down to 1% resulting in an increased signal tonoise ratio; thus the design of the readout electronics in the IC 12and/or PCB 9 may be greatly simplified.

One or more reference sensors (not shown) may be implemented on the IC.Reference sensors may be similar to optical sensors 40 discussed aboveand may be matched in size, orientation, and may be surrounded by asimilar environment (e.g., both reference sensors and optical sensors 40may be surrounded by the same dummy structures, same magnetic fieldgenerators). Reference sensors can be covered fully or partially bypoly-silicon layers, metal layers, other substantially opaque materialsor combinations thereof such that no light, or a relatively small amountof light, or a pre-determined amount light from the light source 2 isincident on the reference sensors. The reference sensors, such as theoptical sensors 40 covered by material to block the light from the lightsource 2, may be used to measure the dark current of the associatedphotodiodes which may be used for calibration and offset cancellationpurposes, for example, when placed in differential configuration with anoptical sensor 40 that is exposed to the light source 2. Referencesensors can be identical to the optical sensors 40 but the system 10 canbe configured to prevent particles 4 from landing over them (e.g., thereference sensors may be in a chamber with no particles, particles maybe removed from the reference sensors by very strong forces, or anyother configurations of ensuring that the surface 7 of these referencesensors is not covered by particles). Reference sensors may be used tomeasure the ambient light intensity which may be used for calibrationand/or offset cancellation purposes.

FIG. 6 shows a cross section view of the IC. Optical sensing areas(e.g., Optical sensing area 1 50 and Optical sensing area 2 51) may bepost processed so that the plane of the optical sensing areas ispositioned below that of the rest of the IC 12 (e.g., in trench 52 andtrench 53) in order to allow more light to reach the optical sensors 40and to minimize light scattering that may effectively degrade shadows orother modulation of the light due to particles 4. The etching process isdescribed in PCT Publication No. WO 2009/091926. A metal etch stop layerabove the optical sensor 40 can be used to stop the etching process.Once the silicon dioxide is etched away from above the etch stop metallayer, the metal layer and the metal strap can be etched to expose thesilicon dioxide underneath, leaving only a transparent layer of siliconoxide. An IC 12 can have more than one optical sensing area 41. Eachoptical sensing area 41 may be coated with a different receptor that isspecific to a unique target analyte. For example, the surface 54 oftrench 52 may be coated to capture one analyte while the surface 55 oftrench 53 may be coated to capture another analyte. Having a separatetrenches for each receptor may prevent cross-contamination of receptorsduring coating (e.g., prevent droplets from mixing during amicro-spotting process), as is often the case in systems with flattopologies. Coffee ring effects (e.g. non-uniform concentration of thereagents and/or receptors) may be avoided or reduced by coating thesurface in trenches. Each trench may have its own reaction chamber. Forexample, trench 52 may be isolated from trench 53 by a capillary wallabove the boundary between the two trenches such that the aqueous sample5 in contact with trench 52 does not mix with the aqueous sample 5 incontact with trench 53. Particles 4 in each trench may be coated withdifferent receptors. The surface in a trench may be coated with morethan one receptor, either by mixing two or more receptors and coatingthe whole trench or by coating the surface of the trench with eachreceptor in different portions of the trench. In one variation of theIC, trenches can be omitted altogether (i.e., the surface 7 of the chipmay be essentially flat) and different regions on the IC 12 may befunctionalized with different receptors. The detection and/orquantitation of multiple target species can be performed concurrently,for example, by coating different sections or the chip or differenttrenches with different receptors. The application of differentreceptors in different trenches can be performed through variousmicro-arraying techniques, namely contact micro-arraying or printmicro-arraying.

FIGS. 7A, 7B, and 7C show a top view and cross sectional views,respectively, of the light source 2 and the IC 12. One or more magneticseparation field generators can be embedded in the integrated circuit 12at a lateral distance of 0.1 μm to 100 μm from the optical sensing area41. Magnetic particles 81 that had previously reacted with one or moretarget species or react with one or more target species found on thesurface 7 of the IC 12 may bind strongly through specific bio-chemicalor inorganic interactions to the surface 7 of the IC 12 exposed to theaqueous sample 5. Magnetic particles 81 that had not reacted with one ormore target species may bind weakly to the surface 7 of the IC 12through non-specific interactions. The magnetic separation fieldgenerators can be used to remove the non-specifically bound magneticparticles from the optical sensing areas 41 so that the optical sensors40 only detect specifically bound magnetic particles. The magneticseparation field generators can be implemented as electrical separationconductors 60 embedded in the integrated circuit 12 and routed inproximity to the optical sensing area 41. Current passing through theseparation conductors generates magnetic forces that act on the magneticparticles 81 inside the optical sensing area. The current can be from0.01 mA to 200 mA depending on the separation force desired. Apreferable value for the current passing though separation conductors toseparate 4.5 μm magnetic particles ranges from 1 mA to 50 mA. Theseparation conductors 60 on either side of the optical sensing area 41can be activated at different times in order to pull the magneticparticles 81. The current can be toggled between the two separationconductors at arbitrary frequency from 0.001 Hz to 100 MHz. The magneticseparation forces can be strong enough to displace non-specificallybound magnetic particles from the optical sensing area towards theseparation conductor, but not strong enough to displace specificallybound magnetic particles. Non-specific binding forces may be on theorder of 0.1-10 pN, while specific binding forces may be on the order of20 pN to 20 nN. For example, magnetic particle 62 may sediment overoptical sensor 64 and may specifically bind to the surface 7 of the IC12 over optical sensor 64. Thus, magnetic particle 62 may not be removedby the separation force generated by a separation conductor 60 placedlaterally to the optical sensing area 41 and may be detected by opticalsensor 64. On the other hand, magnetic particle 63 may sediment overoptical sensor 65 and may not bind specifically (i.e., non-specificallybind) to the surface 7 of the IC 12 over optical sensor 65. Thus,magnetic particle 63 may be removed by the separation force generated bythe conductors placed laterally to the optical sensing area 41 and maynot be detected by optical sensor 65. The electric currents used togenerate magnetic forces may be pre-programmed onto the IC 12 during thedesign process or after fabrication and may be adjusted at a later stage(e.g., before the assay or dynamically during the operation of theassay) depending on various parameters (e.g., temperature, viscosity ofthe aqueous sample 5, magnetic content of the magnetic particles,size/shape of the magnetic particles, and other factors). Magneticforces can be generated externally to the integrated circuit 12 usingone or more permanent magnets or external electromagnets (e.g., coilsintegrated onto the PCB 9). In a variation of the system 10, magneticseparation field generators may be omitted altogether from the IC 12.

FIGS. 8A and 8B show a top view and a cross section view, respectively,of the light source 2 and the IC 12. Magnetic separation fieldgenerators can be embedded in the IC 12 at a lateral distance of 0.1 μmto 100 μm from the optical sensing area 41. A separation area 70 overthe magnetic separation conductors 60 may contain optical sensors 40 fordetecting magnetic particles 81. Magnetic forces generated by separationconductors 60 may remove non-specifically bound magnetic particle 72from the optical sensing area 41 and onto the separation area 70.Optical sensor 74 in the separation area 70 may be used to determine theefficacy of magnetic concentration field generators, described furtherbelow in reference to FIGS. 9A and 9B. Since magnetic concentrationfield generators should concentrate more magnetic particles 81 over theoptical sensing area 41 than over the nearby separation areas 70,calculating a concentration ratio, defined as the number and/or densityof magnetic particles 81 sedimented in the optical sensing area 41divided by the number and/or density of magnetic particles 81 sedimentedin the separation area 70, may verify and measure the efficacy of themagnetic concentration field generators. It is preferable that theconcentration ratio is between 2:1 to 100:1.

In addition to quantifying the number of remaining specifically boundmagnetic particles in the optical sensing area 41, the number and/ordensity of magnetic particles removed from the optical sensing area 41may be quantified or estimated by the optical sensors 40 in theseparation area 70, thus giving an estimate of the total number ofmagnetic particles sedimenting on the IC 12 surface 7. This facilitatesa calculation (e.g., by the control module) of a ratio of magneticparticles removed and/or magnetic particles remaining compared to thetotal number of magnetic particles. Measuring this ratio or thepercentage of particles specifically binding to the surface 7 maycorrect for various errors, such as those stemming from variations inthe total amount of magnetic particles introduced to the IC 12 surface7, which may be different between systems, and any other error sourcessuch as improper use, manufacturing detects, or combinations thereof.Another method for calculating this ratio is to quantify the numbermagnetic particles in the optical sensing areas 41 both before and aftermagnetic separation. This method allows the magnetic separation areas 70to be omitted while still obtaining the ratio. Further, the opticalsensors in the optical sensing area 41 and the separation area 70 can beused to retrieve ensemble statistics of the magnetic particles 81, suchas total number of magnetic particles 81 in the system 10, and theamount of particle 4 clumping.

FIGS. 9A and 9B show a top view and a cross sectional side view,respectively, of the light source 2 and the IC. Magnetic concentrationfield generators embedded in the integrated circuit 12 can be used toattract the magnetic particles 81 onto one or more optical sensing area41s on the surface 7. The magnetic concentration field generators can beimplemented as electrical concentration conductors 80 embedded in theintegrated circuit 12 and routed through one or more optical sensingareas 41. Current passing through the concentration conductors 80 maygenerate magnetic forces that attract the magnetic particles 81 to thesurface 7 of one or more optical sensing areas 41. The current flowingthrough the concentration conductors 80 can range from 10 μA to 200 mA,depending on the strength of magnetic particle concentration forcedesired. These currents may broadly correspond to magnetic forces from 1fN to 1 nN, largely depending on the size of magnetic particles 81.Concentrating magnetic particles 81 over the optical sensors 40, ratherthan allowing them to land randomly on the surface 7, may alter (e.g.,increase) the accuracy and/or performance of the assay (e.g., byincreasing the chance of magnetic particles 81 binding specifically inthe optical sensing area 41). The concentration conductors 80 may speedup the sedimentation process of the magnetic particles 81 and thusdecrease the time to perform the assay. In a variation of the IC, theconcentration conductors 80 may be omitted altogether. A permanentmagnet or an electromagnet (e.g., a coil integrated into the PCB 9) maybe used instead of a concentration conductor 80 to concentrate magneticparticles 81 onto the surface 7 of the IC 12.

FIG. 9A shows the concentration conductor 80 in between two columns ofoptical sensors 40. The concentration conductor 80 can be placeddirectly over a column of sensors. The magnetic forces generated byconcentration conductors 80 may be pre-programmed onto the IC 12 duringdesign of fabrication and may be adjusted at a later stage (e.g., beforethe assay or dynamically during the operation of the assay) depending onvarious parameters (e.g., temperature, viscosity of the aqueous sample5, magnetic content of the magnetic particles 81, size/shape of themagnetic particles 81, and other factors).

FIGS. 10A and 10B show a top view and a cross section view,respectively, of the light source 2 and the IC 12. Two concentrationconductors 80 can be placed over and/or next to one or more opticalsensing areas 41. These concentration conductors 80 may be both turnedon (i.e., a current passes through both conductors and a magnetic forceis generated that is similar to a force from one concentration conductor80 as described in reference to FIGS. 9A and 9B) in order to concentratemagnetic particles 81 over or next to the optical sensing areas 41.Current may be alternated from one the right concentration conductor 90to the left concentration conductor 91 (i.e., only one concentrationconductor is turned on at a time and the current switches to the otherline in a predetermined, calculated, or random time internal). When thishappens, a magnetic particle 81 landing on the surface 7 may be rasteredacross the optical sensing area 41 (i.e., moved back in forth on thesurface 7 over an optical sensor 93), thereby increasing the chance thatthis magnetic particle 81 will specifically bind to the surface 7 of theIC 12. The chance of binding and by extension the sensitivity of theassay increases proportionately with the increase in surface 7 area ofthe magnetic particle 81 that comes in contact with the optical sensingarea 41. More than two concentration conductors may be placed in anyorientation as to raster the magnetic particle 8 lover an opticalsensing area 41 in any fashion. This rastering of the magnetic particles81 can also be used to eliminate the non-specific binding that canresult from the magnetic particles 81 remaining stationary on thesurface 7 of the IC 12 for an extended period of time, (e.g.. from 1second to 10 minutes). Two separation conductors 60 can be placed oneach side of a column of an optical sensing area 41. The innermostseparation conductors 94, which are closest to the optical sensing area41 may be turned on first to remove non-specifically bound particlesfrom the optical sensing area 41 and attract them towards the innermostseparation conductors 94. Only one separation conductor is turned on atone time and the current can be toggled between the two parallelsseparation conductors 94. Subsequently, the innermost separationconductors 94 closest to the optical sensing area 41 may be turned offand the outermost separation conductors 95 may be turned on to removenon-specifically bound magnetic particles from the innermost separationconductors 94 and attract them towards the outermost separationconductors 95. Only one separation conductor is turned on at one timeand the current can be toggled between the two parallels separationconductors 95. More than two separation conductors 60 may be placed inthis fashion on each side of a column of optical sensors in order tomove the magnetic particles 81 arbitrarily far away from the column ofoptical sensors. Attracting the magnetic particles 81 to the innermostconductors may require less than 20 mA of separation current, whereasdirectly attracting magnetic particles 81 from the sensor surface 7 tothe outermost conductors may require as much as 3 times more separationcurrent. Stacking or rastering two or more such separation conductors 60may thus result in a reduction of power dissipation or energyconsumption of the IC 12. More combinations of numbers of concentrationconductors 80 and separation conductors 60 (e.g., two concentrationconductors 80 and four separation conductors 60) may be used for eachoptical sensing area 41. In one variation of the system 10, magneticseparation field generators may serve as a magnetic concentration fieldgenerators (i.e., the magnetic separation field generators may be usedto concentrate magnetic particles 81 to or close to the optical sensingareas 41), and magnetic concentration field generators may also serve asmagnetic separation field generators (i.e., the magnetic concentrationfield generators may also be used to remove non-specifically boundmagnetic particles 81). Thus, in a variation of the system 10, themagnetic concentration field generators and/or the magnetic separationfield generators can be omitted.

FIGS. 11A and 11B show a top view and a cross section view,respectively, of the light source 2 and the IC 12. Metal, poly-silicon,or other opaque or mostly opaque materials can be integrated into the IC12 serve as a light shield 101 for the optical sensors. The light shield101 may surround an optical sensor 40 to reduce the angles of acceptanceof light of the optical sensor 40 and reduce stray light (e.g.,dispersed, reflected, or refracted light coming from direction or fromcross talk from nearby optical sensors) by more than 90%. The lightshield 101 may or may not overlap a part of the optical sensor 40 andmay be made out of a stack of several layers (e.g., poly-silicon, metal1, metal 2, and other on-chip metal layers or other opaque layers). Tofurther prevent stray light from shining on the optical sensor 40, theILD space between the light shield layers 101 may be surrounded by vias102 connecting each layer together. The vias 102 may be implemented in astandard process (i.e., where they are a predetermined size and/or havea predetermined inter-via spacing) and may surround the optical sensor40 as densely as possible. Alternatively, the vias 102 may beimplemented in a special process and may completely surround the openingto the optical sensor 40 between each pair of light shield layers 101 inorder to completely block stray light from shining on the opticalsensors. Reducing the stray light shining on a sensor may increase thecontrast of the optical sensor 40 (i.e., the ratio between the amount oflight illuminating the sensors with a particle 4 over the sensors andwithout a particle 4 over the sensor). This architecture can allow forthe IC surface 7 to be relatively far away from optical sensors 40(e.g., greater than 5 μm) without introducing significant stray light,which may be difficult to achieve without a light shield layer 101 andvias 102. By having a thick ILD above a sensor may reduce the lightintensity incident on the optical sensors but may also allow forintegration of more metal layers that may be used to perform variousfunctions (e.g., carrying digital/analog signals, serving as powerlines, concentration lines and/or separation wires).

As discussed above, for maximal detection signal-to-noise ratio, theoptical sensor 40 may be smaller than the particle 4 such that the lightfrom the light source 2 is fully attenuated. Alternatively, the sensorcan be larger than the bead, but the opening in the light shield can besmaller such that the aperture is fully covered by the particle. Despitetheir reduced sensitivity, CMOS photodiodes may be superior to otherphotodetector implementations due to their high dynamic range (i.e.ability to detect a large range of light intensities). This largedynamic range can facilitate calibration of the intensity of the lightsource 2 to calibrate for the opacity of the sample for example.

The surface 7 of the IC 12 above the optical sensors may be composed ofan interlayer dielectric (ILD) that is typical in CMOS processes andother commercial IC fabrication processes. This surface 7 may becomposed of silicon oxide (e.g., LPCVD oxide, TEOS oxide), siliconnitride, silicon oxy-nitride, polyimide, or any other suitable material.The ILD can be modified prior to surface 7 coating (e.g., smoothenedusing chemical-mechanical processing, roughened and/or renewed using awet etch, or combinations thereof). Prior to coating the surface 7 ofthe IC 12, an optically transparent material (e.g., evaporated siliconoxide, ITO, thin layer of metal, and any other material that may becoated and is at least partially optically transparent) can be depositedon the IC 12 to serve as an interfacial layer between the ILD materialand the biological species used to functionalize the surface 7. Theinterfacial layer, as well as the rest of the ILD, need to betransparent or at least partially transparent to allow light toilluminate the optical sensors below. Having such an interfacial layercan allow the flexibility of using any material for surface 7 coatingregardless of the actual ILD used in the fabrication of the IC, whichmay not be suitable for biological surface 7 coating itself. The silicondioxide ILD layer can be coated with a hetero-bifunctional cross linkersuch as a silane linker to attach the desire chemical to the surface 7.The attachment link may be, for example, a biotin/streptavidininteraction that may be conjugate a capture species, such as a nucleic12 acid, an antibody, or another protein to the surface 7 of the IC 12.Instead of an optically transparent surface 7 for coating, an opaquesurface 7 (e.g., gold metal, carbon nanotubes, or combinations thereof)may be used and patterned into thin strips such that light may stillpass between the strips and thus particles 4 binding to the surface 7may still be detected.

Magnetic sensors (e.g., Hall effect sensors, magnetoresistive sensors,or combinations thereof) may be integrated onto the IC 12 in addition tothe optical sensors described above. The magnetic sensors may beconfigured to measure the amount and/or distribution of magneticmaterial in the magnetic particles 81. The results of the measurementmay be used in adjusting the separation and concentration forces and/orin changing the assay calibration parameters, as described above.Magnetic sensors may be used for other purposes, such as detectingmagnetic particles 81, measuring and/or calibrating magnetic forcesgenerated by other components of the system 10 (e.g., magneticseparation force generators, magnetic concentration force generators,external magnetic field forces such as a coil or a permanent magnetic).The magnetic sensors may also be configured in an array and may also beindividually addressable. Magnetic sensors may be used to detect ambientmagnetic fields; this information may be used to adjust the assaycalibration parameters and/or to invalidate the assay results (e.g. whenambient magnetic fields are sufficiently strong to disrupt assayperformance).

In a variation of the IC, the optical sensors can be replaced withmagnetic sensors (i.e., the detection of particles 4, which mustnecessarily be magnetic particles 81, is performed by the magneticsensors). However, CMOS optical sensors have several advantages overmagnetic sensors. Optical sensors use less power than magnetic sensors(micro-amps versus milli-amps per sensor), can be readout more quickly(microseconds versus milliseconds per sensor) and can be more denselyarrayed (arrays of millions versus tens of thousands). Moreover, theoptical sensors can better control the protocol since they can detectthe reagent sphere 3 re-hydrating by the change in the light reachingthe surface 7 of the IC 12 and indirectly measure the viscosity of thesample.

FIG. 12 shows a top view and of the IC 12. Different regions of the chip(e.g., different trenches, different array banks, sections on the IC 12spotted with a different receptor) can contain different concentrationsor amounts of a particular receptor. For example, Assay Region 1 114 maybe coated with the same receptor as first assay region 115 and secondassay region 116, but may contain only 10% or some other predeterminedpercentage of the receptor surface concentration of first assay region115. Likewise, first assay region 115 may contain only 10% or some otherpredetermined percentage of the receptor surface concentration of secondassay region 116. By having different amounts of each receptor indifferent regions of the chip may result in: (1) broader detectiondynamic range by ensuring a receptor concentration exists that does notresult in signal saturation or too low of a signal (i.e., too few if anybound particles 4), (2) error checking functions by cross-checking eachreceptor concentration to make sure a signal is consistent, and (3)providing the ability to perform quantitative controls. Assay regionshaving different target analytes and/or different concentrations of aparticular receptor to a single target analyte may be coated in commoncentroid fashion (i.e., all sets of regions with the same characteristichave a common center or approximately common center on the surface 7 ofthe IC 12).

FIG. 12 shows that different regions of the chip (e.g., differenttrenches, different array banks, sections on the IC 12 spotted with adifferent drop) can contain different concentrations or amounts of aparticular receptor. Negative control regions are defined as regionswhere target analyte cannot be detected, independent of the actualconcentration of the target analyte in the aqueous sample. For example,negative control regions (i.e., first negative control region 117 andsecond negative control region 118) may not be coated with a receptor tothe target analyte. As a result, particles 4 will not bind to thesurface 7 in the negative control region. As discussed above negativecontrols may be achieved by a prevention chemical instead to ensure thatno binding occurs. Negative controls may be used to ensure thatparticles 4 are introduced over the surface 7 in the negative controlregion (i.e., this checks that particles 4 exist and that they have aproper surface concentration range). Factors such as improper or oldreagents, poor environmental conditions, and misuse by the user maycause particles 4 to bind even though no target analyte is present.Having negative controls ensures that the reagents present in the system10 and environmental conditions of the surroundings (e.g. temperature)allow for regions with no target analyte to exhibit no specific bindingor strong non-specific binding. Positive controls regions (i.e., firstpositive control region 110, second positive control region 111, thirdpositive control region 112, and fourth positive control region 113) aredefined as regions where the particles 4 can bind specifically,regardless of the concentration of the target analyte in the aqueoussample. For example, positive control regions or positive control samplechambers may contain dried and bound target analyte or any other sort oftarget analyte or another molecule that mirrors a target analyte suchthat binding events occur (i.e., particles 4 bind to the surface 7).Factors such as improper or old reagents, poor environmental conditions,and misuse by the user, may hinder specific binding. Thus, havingpositive controls can ensure that the reagents present in the system 10and environmental conditions of the surroundings (e.g. temperature)allow for successful binding to take place. Both negative controls andpositive controls may be used to detect and compensate and/or correctfor environmental variations (e.g., temperature, mechanical stress,light level, orientation of the system 10, and other sources ofvariations). Negative and positive controls may be used to dynamicallymodify the assay calibration parameters and other modifiable parameterson the chip (e.g., various magnetic forces, assay time, or combinationsthereof). Controls can be performed concurrently with the assay.

FIG. 12 shows that one or more of the positive control regions (i.e.,first positive control region 110, second positive control region 111,third positive control region 112, and fifth positive control region114) can be controls that correspond to a particular concentration oftarget analyte (i.e., between negative and positive). This may beimplemented, for example, by having different amounts of dried and boundtarget analyte in each region or by having a different amount ofreceptors that bind to the target analyte. For example, first positivecontrol region 110 may contain a high concentration of dried and boundtarget analyte on the surface 7 or optionally in a chamber separatingfirst positive control region 110 from other regions, whereas secondpositive control region 111 may contain a smaller predeterminedpercentage of the dried or lyophilized target analyte (e.g., 10% of theamount for first positive control region 110). Third positive controlregion 112 and fifth positive control region 114 may contain differentamounts of lyophilized target analyte as well. By having several levelsof controls, one may more accurately determine the assay calibrationparameters as the assay progresses than when using just negative andpositive controls, and thus one may more accurately compensate thereading for environmental changes, reagent variations, and user misuse,that may contribute to changing the signal level. The positive controlsthat ensure binding can also be used to measure the binding forces ofthe specific interaction by applying a know force on the magneticparticles 81.

In a variation of the system 10, all or a portion of particles 4 in theSPDM 8 may be pre-coated with the target analyte and thus may alwaysspecifically bind to the surface 7 of the IC 12. This may be effectivelyanother way of implementing positive controls that can ensure that thereagents present in the system 10 and environmental conditions of thesurroundings (e.g. temperature) allow for successful binding to takeplace.

The use of integrated circuit 12 technology can enable scaling thenumber of sensor to a high density or quantity of sensors, such as overa thousand or over a million individual sensors, or a low density orquantity of sensors (e.g., 10-100 sensors). A high number of smallsensors can provide large detection areas while each sensor stillretains high sensitivity to small particles 4 (i.e., only small sensorscan detect small particles 4 with high fidelity in a practical amount oftime). Such characteristics cannot be achieved with a few large sensorsas large sensors would not be sensitive enough to detect small particles4. Having a high density of sensors over large detection areas, one IC12 may contain several regions for detecting multiple analytes andhaving multiple control levels, with each region being of sufficientsize to obtain accurate target analyte concentration readout.

The optical sensors may be configured to detect particles 4 in realtime, prior to the particles 4 actually coming in contact with thesurface 7 of the IC 12. For example, an optical sensor 40 may sample thelight intensity at very short intervals (e.g., once every 1 ms) andtherefore may be able to detect a particle 4 that is approaching andabout to land on the surface 7 (e.g., when the particle 4 is severalmicrometers away from the surface 7). In this way, the optical sensorsmay be used to measure the sedimentation velocity of the particles 4 andtherefore provide information about the properties of the particles 4(e.g., surface 7 roughness, size, density, weight) and/or the propertiesof the aqueous sample (e.g., viscosity, flow). As discussed above, theseparameters may be used in adjusting the assay calibration parameters andother parameters to further improve the accuracy of the assay. Ingeneral, optical sensors may detect particles 4 within 1-20 um ofcontact with the surface 7, depending on the particle 4 size.

The optical sensors may be configured to detect particles 4 that arenanometer sized (e.g., between 5 nm to 500 nm in diameter).Nanometer-sized particles 4 (also referred to as nanoparticles) may beused to measure the binding kinetics of a target analyte. This can bedone, for example, by measuring the light intensity of the opticalsensors at short time intervals (e.g., every few milliseconds to everyfew seconds) to determine how quickly the nanoparticles settle and bindto the surface 7 of the IC 12. Binding kinetics may be represented byparameters associated with the rate of binding and unbinding of thebonds between target analytes and receptors (e.g., rate constants,activation energies, association constants, dissociation constants,equilibrium levels, and other parameters). The control module or anexternal computing device may be used to calculate the binding kineticsparameters from the measurements obtained by the optical sensors. Evenif an optical sensor 40 is not capable of detecting a singlenanoparticle, an array of optical sensors or one optical sensor 40 maybe able to detect several (e.g., tens to thousands) nanoparticles,thereby still providing an estimation of the binding kinetics of thatparticular target analyte. Binding kinetics may be useful for assaycharacterization, drug discovery, and many other applications and may beused in modifying the assay calibration parameters. External magnets(e.g., coils integrated onto the PCB 9) or on-chip electromagnets (e.g.,concentration conductors 80) may be used to pull the magneticnanoparticles towards the surface 7 to speed up binding kinetics and topull them away from the surface 7 to perform separation. Thenanoparticles used do not necessarily need to be magnetic in order tomeasure the binding kinetics; the nanoparticles simply need to modulatethe light intensity hitting the sensor (e.g., by being fully orpartially opaque or by reflecting, refracting, or dispersing the light).Using optical sensors for measuring binding kinetics, as opposed tomagnetic sensors, is generally a preferred method as it allows usingnon-magnetic particles. Further, magnetic sensors require that magneticparticles 81 be polarized prior to detection, which is difficult toperform without imparting significant magnetic forces on the magneticparticles 81 and thus distorting kinetic measurements. Neither theoptical sensors 40 nor the light source 2 impart significant forces onthe particles 4 and thus kinetic measurements are undistorted.

The system 10 can be configured to permit variation of the environmentalconditions between multiple sensing areas. Environmental conditions mayinclude temperature, viscosity, pH, and other physical, chemical, andbiological parameters. One or more heating elements and thermometers maybe incorporated into the surface 7 such that they permit localizedtemperature control within one or more sensing areas. Electrodes may beplaced in or in the vicinity of optical sensing areas 41 and may be usedto modify the pH and/or ion concentration of the aqueous sample 5 in theoptical sensing areas 41 by placing a potential difference between theelectrodes. By simultaneously performing multiple assays while varyingenvironmental conditions, assay specificity may be improved, and theinfluence of external environmental parameters can be reduced.

Different ensembles of particles 4 can be colored with dyes or metalnano-particles. Ensembles of particles 4 of different color can becoated with different chemicals and/or different concentrations of thesame chemical in order to perform multiple assays concurrently. Theoptical sensors 40 in the IC 12 can detect the different colors that cancorrespond to different target analytes or different concentrations ofthe same analyte. As discussed above, different types of photodiodes orbayer color filters can also be used to detect the different colors.

Different ensembles of particles 4 can be darker. Optical sensors 40 inthe IC 12 can measure the amount of light and determine the type ofparticle. Using these approaches, multiplexed assays and assays withcomprehensive assay controls can be performed by the same IC 12 in thesame sedimentation capillary 13.

FIGS. 13A and 13B show a top and cross-sectional side view respectivelyof a portion of an integrated circuit 12 with two magnetic particles onits surface 7.

FIG. 13A shows a current I1 passing through separation conductor 126.The current I1 can generate a magnetic field that pulls magneticparticle 124 with a magnetic force F1. The vector of the force F1 pointsin the direction of the separation conductor 126. The current I1 can beramped at arbitrary rate or modulated in amplitude and frequency atarbitrary rate. Different force ramps can provide information on theaffinity of the bond. A current I2 of different intensity can passthrough separation conductor 127 simultaneously, resulting in a magneticfield generating a magnetic force F2 on the magnetic particle 125.

FIGS. 14A and 14B show a top and cross-sectional side view respectivelyof a portion of an integrated circuit 12 with two magnetic particles onits surface 7. Force F1 can be strong enough to displace magneticparticle 124 from atop optical sensor 120, but force F2 can be weakenough to leave magnetic particle 125 immobilized atop optical particles121.

Biological samples can have variations (e.g., in pH and ionIC 12strength) that can affect the strengths of the specific and non-specificbonds. These variations cannot be known a priori, so magnetic forces mayneed to be dynamically tailored to the sample for accurate detection ofone or more target analytes. To do so, the strengths of the specific andnon-specific bonds can be measured prior to performing the assay and themagnetic forces used for separation may be adjusted accordingly. Tomeasure the strength of the non-specific or specific bonds, magneticfields of increasing strengths may be generated by passing current ofincreasing intensities through the magnetic separation field generatorsand measuring, at each time instant, the amount, concentration,proportion, or ratio of magnetic particles 81 removed from an opticalsensing area 41 or remaining on an optical sensing area 4. The strengthof the non-specific bonds may correspond to the smallest magnetic fieldof the series of increasing magnetic fields that removes a predeterminedportion (e.g., one half) of the non-specific bound magnetic particles 81from the optical sensor areas 41. To ensure that only non-specific bondsare measured, optical sensor areas 41 may be coated with a preventionchemical that may prevent a binding with the surface 7 of the magneticparticles 81, such as casein or albumin. To ensure that only specificbonds will be measured, the sensor areas 41 may be coated with anactivation chemical that may ensure binding with the surface 7 of themagnetic particles 81 61, such as one or more of the target analytes.

Statistical analyses can be performed (e.g., by extracting peaks from ahistogram of forces that remove a certain amount or percentage ofparticles 4) to determine what the non-specific binding forces andspecific binding forces are. Several other parameters may be varied,such as the rate of the increase of the magnetic separation force or theamount of time each magnetic force is applied, that may provide moreinformation on the binding forces and may be used to adjust theamplitude, rate, and time of magnetic separation forces while performingan assay. The measurement of the specific and non-specific bonds may beperformed simultaneously on-chip by multiplexing. An assay may beperformed concurrently with the specific and non-specific bondmeasurements, and the results from the specific and non-specific bondmeasurements may be used to interpret the results (e.g., adjust theassay calibration parameters). The specific and non-specific bondmeasurements results may be used to calibrate the magnetic forces in asubsequent assay. This subsequent assay may be performed on the sameintegrated circuit 12, but subsequently to the specific and non-specificbond measurements. The specific and non-specific bond measurementsresults may be retrieved in real-time and used to calibrate the magneticforces in a concurrent assay. This concurrent assay may be performed onthe same integrated circuit 12 or on another integrated circuit 12.

The use of a range of magnetic separation forces can be used to increasethe dynamic range of the assay. Different separation conductors 60 canproduce different forces on the magnetic particles 81 in order todiscriminate between the particles 4 with few specific interactions(e.g. 1-10) and many specific interactions (e.g. 10-100). In thismanner, low and high concentration of the target analyte can bequantified using the same IC 12 at the same time without saturating theoptical sensors 40 with many specifically bound magnetic particles 81 orremoving all the magnetic particles 81 into the separation region 70.The use of a range of magnetic separation forces can be used toindependently optimize multiple assays run concurrently on the same IC12. The different reagents needed to perform multiple assays reactdifferently to different sample matrixes. By using different forces, theseparation forces for each assay can be independently calibrated foroptimal performance.

FIG. 15 shows a cross-section side view of the system 10 with driedreagent 150 throughout the delivery capillary 14 and the sedimentationcapillary 13. The dried reagent 150 inside the delivery capillary 14 andsedimentation capillary 13 can promote wicking of the aqueous sample 5by absorbing and dissolving in the aqueous sample 5 and thus promotingsample transport through the system 10. The dried reagents 150 can bedried or lyophilized; they can be inert ingredients (such aspolyethylene glycol) or may be functionalized by includinganti-coagulation agents or other suitable reagents. The dried reagents150 may incorporate thickening or other viscosity control agents. Thereagents may be homogenous or heterogeneous: for example, layers ofslowly-dissolving inert material may be placed between layers of activereagents to ensure sufficient reaction time. The capillaries can bemanufactured from a transparent material, for example plastic, glass, ora combination thereof, to transmit light to the surface 7 of the IC 12.The sedimentation capillary 13 and the delivery capillary 14 can be madeof a flexible material to allow for a tight seal to the surface 7 of theIC 12 by compression from above. A gasket can also be used to seal theinterface between the bottom of the capillaries and the surface 7 of theIC. The bottom of the capillaries can also be placed above the surface 7of the IC 12 by a distance less than 5 mm and gravity can ensure thatthe aqueous sample 5 is wicked onto the surface 7 of the IC 12. Multipledelivery capillaries can lead to multiple sedimentation capillaries thathold different reagent spheres 3. These sedimentation capillaries can beover different areas of the same IC or different IC s.

FIG. 16A and FIG. 16B are cross-section side views of the top inlet tothe delivery capillary 14. In FIG. 16A, dried reagents 150 are locatedin proximity to the filter 6 with an air gap 151 separating them (whichmay be a result of manufacturing tolerances). In FIG. 16B the driedreagents 150 are placed in direct contact with the filter 6. The driedreagents 150 accelerate the transfer of aqueous sample 5 through thefilter 6 material by absorbing and dissolving in the sample fluid. Thedried reagents 150 can promote the wicking of fluid from the input portto the delivery capillary 14, which can otherwise be obstructed bysurface 7 tension effects.

FIG. 17 is a cross-section side view of another version of the inlet tothe delivery capillary 14. Wicking capillaries 160 of smaller diameterthan the delivery capillary 14 can be placed in proximity to the filter6. The wicking capillaries 160 can accelerate the transfer of theaqueous sample 5 through the filter 6 material. The wicking capillaries160 may have a constant diameter, or may be tapered in a way to promotethe flow of the aqueous sample 5. The wicking capillaries 160 can bemanufactured using injection molding, micro-injection molding, extrusionor micro-fabrication. The wicking capillaries can be from 10 μm to 10 mmwide and from 10 μm to 10 mm long.

FIG. 18 is a cross-section side view of another version of the inlet tothe delivery capillary 14. A layer of dried reagents 150 is placedbetween the filter 6 and the wicking capillaries 160. The dried reagents150 dissolve and promote the transfer of aqueous sample 5 through thefilter 6 material, and the wicking capillaries 160 assist with wickingthe fluid into the delivery capillary 14, which may be of a largerdiameter.

FIG. 19 is a cross-section side view of a variation of the inlet to thedelivery capillary 14. A layer of porous material 180 can be placedbetween the filter 6 and the delivery capillary 14. The porous material180 can promote the transfer of the aqueous sample 5 through the filter6 material by absorbing the fluid. The porous material 180 can be glassfiber, synthetic fibers or other porous materials with pore sizes from0.1 μm to 100 μm.

FIG. 20 is a cross-section side view of a variation of the top of acapillary 192. A spherically-shaped reagent sphere 193 is placed into atapered opening at the top of the capillary 192. A cover layer 191 canbe placed over the opening to keep the reagent sphere 193 stationary.After the placement of the reagent sphere 193, the cover layer 191 canbe attached to the capillary 192 using a ring of double sided tape. Thisvariation may form the inlet of the sedimentation capillary 13, wherethe cover layer may be a gas-permeable seal to let air escape but keepthe reagent sphere 3 stationary. The reagent sphere 3 can bemanufactured by lyophilization with constant agitation of the dispensefluid to ensure homogeneous dispersion of the particles 4 in suspensionprior to dispensation into the liquid nitrogen. This variation may alsoform the inlet to the delivery capillary 14, where the cover layer 191may be the filter 6, and the reagent sphere 193 may act to promote theflow of reagents into the delivery capillary 14. Advantages of thisstructure include a simple manufacturing process: the reagent sphere 193may simply be pick-and-placed into the inlet, and the cover layer placedon top. Because of the conical geometry, the structure can toleratesignificant variation in the diameter of the reagent sphere 193, forexample if the cover layer 191 is made of a flexible material.Recognizable colored dies can be introduced in the reagent spheres 193to aid in the rapid quality inspection of the system 10, i.e. to quicklyensure that the correct reagent sphere 193 has been deposited at the topof the appropriate capillary 192.

FIG. 21 shows a flowchart of a process that can be an assay performed bya particle detection system to quantify the concentration of a targetanalyte. The process shown in FIG. 21 may be implemented using one ormore components of the particle detection system. The sequence of themethod shown in FIG. 21 may differ among variations, and that one ormore elements of the method shown in FIG. 21 may be repeated, replaced,and/or omitted. Further, additional steps may be added in between any ofthe steps shown in FIG. 21.

In STEP 212, a user introduces an aqueous sample 5 (e.g., a finger stickof blood, a fluid from a pipette, or combinations thereof) onto amembrane filter 6 of the system 10, which may be filtered by a filter 6,transported onto the surface 7 of the IC 12, and detected by one or moresensors of the system 10. As discussed above, the membrane filter 6 mayremove particulate matter (e.g., red blood cells, white blood cells,other cells and micron size particulates). Subsequently, the aqueoussample 5 may flow through a capillary over a sensor that is able todetect the presence of the aqueous sample 5. The sensors detecting thefluid may be moisture sensors (e.g., electrodes, optical sensors) on theIC 12 or elsewhere in the system 10, touch sensors near the membranefilter 6 or elsewhere on the device, temperature sensors, and any otherelements for detecting the presence of the aqueous sample 5. Themoisture sensors can be omitted and/or no detection of the aqueoussample 5 takes place (i.e., STEP 212 may be omitted). After STEP 212,the process proceeds to STEP 214.

In STEP 214, one or more components of the system 10 are enabled inresponse to detecting the presence of the aqueous analyte. For example,sensors detecting the presence of the aqueous sample 5 may send a signalto a control module, which changes state (e.g., switches from an idlestate to an active state). Alternatively, the signal from sensorsdetecting the presence of the aqueous sample 5 may be directly sent toother components of the system 10 to enable or calibrate thesecomponents. Still alternatively, a user or an operator of the system 10enables the system 10 (e.g., with a button, a touch, a voice input, andany other input) which then triggers a change of state in the controlmodule. Prior to enabling other components of the system 10 in STEPS216-232, the control module can enable subcomponents of the controlmodule itself or other auxiliary components (e.g., enable memory banks,enable respective accessory circuitry, enable PCB 9 components such asvoltage regulators, amplifiers, ADCs, and other components standard inthe art). By keeping most components in an off-state and running at lowspeed, the control module can save battery power, for example allowingthe device to stay in an idle state for a long time (e.g., months toyears). In addition to enabling various components, the control modulemay perform certain initialization procedures (e.g., check status of allcomponents, run internal and external error checking routines, and otherprocedures) prior to enabling other components of the system 10 in STEPS216-232. After STEP 214, the process proceeds to STEP 216.

In STEP 216, the light source 2 and the optical sensors 40 may becalibrated. This step may be performed prior to any of the particles 4sedimenting on the surface 7 of the IC 12, and may be performed eitherprior to or after the dissolution of the reagent sphere 3 containing theparticles 4. If either the light source 2 is too strong/weak or theoptical sensors 40 are too sensitive/insensitive, a positive signal(i.e., a particle sedimenting over an optical sensor 40) and a negativesignal (i.e., a particle not sedimenting over an optical sensor 40) maybe difficult to differentiate, and thus a calibration step may benecessary. The light source 2 intensity or duration may be varied untilthe signal from optical sensors reaches a certain level (e.g., half ofthe optical sensor 40 saturation value), and then the time and/orintensity may be stored in memory and used later during actual particledetection. Alternatively, the intensity and time the light source 2 ison may stay constant and the sensitivity of the optical sensor 40 mayinstead be modulated (e.g., by changing the bias voltage). A combinationof these two calibration techniques may be used or that any othercalibration technique may be used, for example, to ensure that thedifference between the signal generated by an optical sensor 40 with aparticle 4over it and an optical sensor 40 without a particle has a highsignal to noise ratio (i.e., can be readily quantified). Calibration maybe not necessary and STEP 216 may be omitted. After STEP 216, theprocess proceeds to STEP 218.

In STEP 218, various environmental conditions may be detected andoptionally stored in a memory. For example, the orientation,acceleration, velocity, or any other physical parameter of the system 10may be detected and measured by one or more inertial sensors and storedin memory. In another example, the temperature of the surroundingsand/or of the aqueous sample may be detected by one or more temperaturesensors and may be stored for later use. In yet another example, theviscosity of the aqueous sample may be measured by one or more viscositysensors and may be stored in memory. Many other parameters exist thatmay modify assay performance (e.g., humidity, time of day, particlevariations, and others) may also be measured and stored in a memory. Themeasurements in STEP 218 may be performed preceding, (continuously ordiscontinuously) concurrent with, or subsequent to the assay.Measurement of environmental conditions may not be necessary and STEP218 may be omitted. After STEP 218, the process proceeds to STEP 220.

In STEP 220, assay calibration parameters may be adjusted based on themeasurement results from any of the prior steps (e.g., temperaturereading, viscosity of aqueous sample, or combinations thereof). Asdiscussed above, assay calibration parameters may include a standardcurve, assay time, magnetic separation force and concentration forceamplitude and duration, and any other parameters that can modify theamount of beads binding, the amount of beads removed, the function fromamount of beads to target concentration (e.g., standard curve), and anyother assay parameter. The adjustment of assay calibration parameters inSTEP X08 may be performed not only prior to the assay, but during theassay, after the assay, and continuously throughout the assay (e.g.,temperature, viscosity, and any other parameters may be monitoredthroughout the duration of the assay and be used in changing the assaycalibration parameters). The assay calibration parameters may be storedin memory and the assay result (e.g., particle number) may be comparedto the assay parameters and/or modified according to the assaycalibration parameters to yield the final assay result. Adjustment ofassay calibration parameters may not be necessary and STEP 220 may beomitted. After STEP 220, the process proceeds to STEP 222.

In STEP 222, the aqueous sample 5 and/or the entire system 10 may beactuated. Actuation may be performed by using a vibrator module tovibrate the entire system 10, by using magnetic field generators (e.g.,external coils) to move magnetic particles 81 about the aqueous sample.As discussed above, actuation of the aqueous sample 5 may speed up assaykinetics and reduce the required assay time. The intensity, frequency,direction, and/or duration of the actuation may be dependent on themeasurements performed in STEPS 216 and 218. Actuation of the aqueoussample 5 may not be necessary and STEP 222 may be omitted. After STEP222, the process proceeds to STEP 224.

In STEP 224, the particles 4 may be concentrated into one or moreoptical sensing areas 41 on the IC 12. By now the aqueous sample 5 mayhave dissolved or partially dissolved the reagent sphere 3 andparticles/reagents may have been released and allowed to mix with thetarget analyte in the aqueous sample 5 and may be sedimenting on thesurface 7 of the IC 12. As described above, the control module mayenable, either in parallel or in series, any magnetic fieldconcentrators integrated on the IC 12 or positioned elsewhere in thesystem 10 to allow the particles 4 to sediment more quickly to the IC 12surface 7 and/or to direct the particles 4 to the one or more opticalsensing areas 41 on the IC 12 surface 7. The particles 4 may sedimentvia gravity randomly on the surface 7 and the concentration step may beunnecessary (i.e., STEP 224 may be omitted). After STEP 224, the processproceeds to STEP 226.

In STEP 226, optical sensors 40, whether in assay regions or controlregions, may be read out (e.g., the signal the optical sensors generatemay be sampled, processed, and/or stored). The readout at this stage mayserve several functions depending on the exact assay protocol and/orapplication. For example, the total number of particles 4 may bequantified and/or estimated prior to any separation steps so that thisnumber may be stored in memory and used later in calculating a ratio ofparticles 4 removed or remaining in one or more optical sensing areas41. Optical sensors 40 may be readout continuously and dynamics ofsedimenting particles 4 (e.g., sedimentation velocity, binding ratekinetics, or combinations thereof) may be measured. Various statisticalchecks and/or error checks may be performed at this stage, such as astatistical analysis of particle distribution to detect any clumping andother non-idealities that may affect assay performance. The measurementof particles prior to separation step (i.e., STEP 230) is not necessaryand STEP 226 may be omitted. After STEP 226, the process proceeds toSTEP 228.

In STEP 228, binding force measurements may be performed onnon-specifically bound particles 4 and/or specifically-bound magneticparticles. As described above, one or more regions on the chip may beused for binding force measurements where magnetic separation forces arecontinuously increased to determine when bonds break (i.e., when theparticles are removed). Statistical analyses may be performed to extractthe patterns and peaks in the separation rate of particles as tooptimize the force intensity and/or duration to obtain the highestsignal to noise ratio in the assay result. STEP 228 may occur before anassay starts and even may take place during a testing process aftermanufacturing. The binding forces may be stored in memory and may beused to adjust the magnetic separation field generators so that thehighest signal to noise ratio is achieved between non-specifically boundand specifically bound magnetic particles. The measurement of bindingforces and calibration of magnetic separation field generators is notnecessary and STEP 228 may be omitted. After STEP 228, the processproceeds to STEP 230.

In STEP 230, non-specifically bound particles are removed from opticalsensing areas 41. As discussed above, this may be performed by magneticseparation field generators and also by any other forces (e.g.,hydrodynamic washing forces, flow forces, gravity, centripetal forces,and other forces strong enough to remove non-specifically bound magneticparticles but not specifically-bound magnetic particles). Opticalsensors 40 may be read out during magnetic separation in order tomonitor the magnetic separation dynamically (e.g., by measuring themotion of the magnetic particles 81). Particles detected in STEP 226 maybe sufficient (e.g., when measuring binding kinetics) and thus removalof non-specifically bound particles may not be necessary (i.e., STEP 230may be omitted). After STEP 230, the process proceeds to STEP 232.

In STEP 232, the optical sensors are read out again to measure theamount and/or surface concentration of specifically-bound particles.Additionally, negative control regions and positive control regions maybe read out as well and the amount and/or ratio of specifically bindingparticles may in the control regions may be used to modify assaycalibration parameters (e.g., the standard curve). Any of the steps 224through 232 may occur in parallel (e.g., separation, readout,concentration may occur concurrently). Particles detected in STEP 226may be sufficient for the assay (e.g., when measuring binding kinetics)and a subsequent readout may not be necessary (i.e., STEP 232 may beomitted). After STEP 232, the process proceeds to STEP 234.

In STEP 234, the concentration of the target analyte may be calculated.As discussed above, the calculation may be performed by comparing theamount and/or concentration of particles binding specifically to thesurface to the standard curve and other assay calibration parameters todetermine what the concentration of the target analyte is. The standardcurve may be programmed onto the IC 12 during manufacturing and mightnot be altered at all. STEP 234 may take place right after STEP 226 forcertain cases (e.g., when measuring binding kinetics of nanoparticles).After STEP 234, the process proceeds to STEP 236. When using one ormultiple analytes, the system 10 may draw conclusions from the varioustarget analyte concentrations and display these conclusions. Forexample, the system 10 may provide a negative/positive indicator (e.g.,for an influenza test) or the system 10 may calculate an indicator thattakes a weighted value of the various target analyte concentrations(e.g., a cardiac Troponin and CK-MB concentrations may be used to outputa heart attack risk indicator). After STEP 234, the process proceeds toSTEP 236.

In STEP 236, the target analyte concentration and/or conclusion may bedisplayed on a display 1 internal or external to the system 10 or may betransferred elsewhere (e.g., via a wireless link, via a USB interface,and any other electronic connection). Prior to sending, the data may beencrypted according to regulatory standards. After STEP 236, the processends.

STEPS 212-236 may be performed for each target analyte that isdetectable by the system 10, either sequentially or in parallel, orSTEPS 212-236 may be performed on multiple analytes at the same time.

In the presence of a source of light, the particles 4 that remain in theoptical sensing area 41 on the surface 7 of the integrated circuit 12may cast a shadow 34 or otherwise modulate the light incident on saidsurface 7. One or more shadows 34 and/or other effects of lightmodulation can be detected by an array of optical sensors embedded inthe integrated circuit 12. The signals from the optical sensors can beprocessed by circuitry embedded in the integrated circuit 12.

The target species can react with the surface 7 of the integratedcircuit 12 before the magnetic particles 81 are attracted by magneticconcentration force or gravitational force. This reaction may cause atleast a portion of the magnetic particles 81 that reach the surface 7 ofthe integrated circuit 12 to bind specifically to the integrated circuit12.

The platform described herein can be used for applications including,but not limited to, diagnostics such as simplex assays, parallel ormultiplexed assays, DNA micro-array assays, glucose, cholesterol,metabolites, and small molecules detection; environmental assays such asfor food contamination, and water and/or soil contamination; proteomicssuch as protein-protein binding force measurements, protein-proteinbinding resonant frequencies, protein kinetics research; genomics suchas DNA methylation profile, and DNA force measurements; magneticparticle 4AFM such as low 1/f noise AFM, AFM with digitally controlledforce and frequency, and multiplexed AFM; Magneic ParticleCharacterization such as exploration of magnetic properties of particlesof different sizes and characteristics; Low Cost Bio-sensor Networkssuch as integrated and direct wireless transmission of assay results,and real-time outbreak and/or contamination monitoring; and anycombinations thereof.

Variations of the systems, devices and methods have been shown anddescribed herein by way of example only. Variations, changes, andsubstitutions can occur. For example, the methods can be performed withany one or more elements of the methods absent, and any one or moreelement of the devices can be omitted. Various alternatives andcombinations of elements between the variations described herein may beemployed. All publications, patents, and patent applications mentionedin this specification are herein incorporated by reference to the sameextent as if each individual publication, patent, or patent applicationwas specifically and individually indicated to be incorporated byreference.

I claim:
 1. A device for detecting a target analyte in an aqueous samplecomprising; an integrated circuit; a first separation conductor and asecond separation conductor embedded in the integrated circuit; a firstcurrent and a second current passing through the first and secondseparation conductors, respectively; and a first and second magneticparticles; wherein the first current passing through the firstseparation conductor generates a first magnetic field that pulls thefirst magnetic particle with a first force; wherein the second currentpassing through the second separation conductor generates a secondmagnetic field that pulls the second magnetic particle with a secondforce; wherein the first and second current are of different intensity;and wherein the first and second magnetic particles are pulled withdifferent forces.
 2. The device of claim 1, wherein sensors embedded inthe integrated circuit detect magnetic particles on the surface of theintegrated circuit.
 3. The device of claim 1, wherein the sensors areoptical.
 4. The device of claim 1, wherein the sensors are magnetic. 5.The device of claim 1, wherein the sensors are sized to detect onemagnetic particle
 6. The device of claim 1, wherein the sensors detectmagnetic particles specifically bound to the surface of the IC.
 7. Thedevice of claim 1, further comprising concentration conductors embeddedin the integrated circuit , and wherein magnetic concentration forcesproduced by current passing through the concentration conductors aresufficient to attract the magnetic particles to the sensing areas. 8.The device of claim 1, wherein the aqueous sample is filtered and wickedvia capillary action through a capillary onto the surface of theintegrated circuit;
 9. The device of claim 8, wherein the aqueous samplecan rehydrate the dry reagent and wherein the magnetic particles can bereleased and sediment through the aqueous sample to the surface of theintegrated circuit;
 10. The device of claim 9, wherein the magneticparticles that react with one or more target species in aqueous samplebind specifically to the surface of the integrated circuit.
 11. Thedevice of claim 10, wherein the first force can be strong enough todisplace the first magnetic particle from atop the first sensor